PrecisionOxygen-free ovenApplication of dry precision electronic components, PI, BCB, LCP curing fire baking, photoresist curing., special process requirements for electronic ceramic materials drying, die-rolling linear heating and cooling environment, especially suitable for semiconductor manufacturing, COB packaging, medical and health, The non-oxidative drying and baking process requirements of flexible circuit board printing, precision mold leg fire and other industries are widely used in dry electronic products, 5 gold products, medical children, instrumentation, factories, colleges and universities, scientific research and other industries.
The high-temperature oxygen-free oven is filled with inert gas (N2 CO2) to discharge the oxygen in the oven, thereby preventing oxidation at high temperature during the baking process.
one,Oxygen-free ovenstructure
The nitrogen-filled oven will fully weld the inner box and seal it, so that the filled inert gas will not leak, and at the same time ensure the internal oxygen-free environment. Even if the ordinary oven is fully welded, it does not need to be sealed.
2, the control system
The high-temperature oxygen-free oven needs to add a nitrogen control system, and at the same time, it needs to have a delay heating function, that is, delay nitrogen filling before heating, so as to ensure that an oxygen-free environment has been formed in the box during heating to avoid high temperature oxidation.
Jardineconductor ovenUsing intelligent temperature controller to achieve automatic baking, process management, with data recording and alarm recording functions, easy management and quality traceability. Convenient control, simple operation, great flexibility. High-precision control, intelligent operation, humanized structure, Greatly increase production efficiency! Semiconductor ovens are designed for durability and high performance, using a high capacity horizontal air recirculation system to maximize temperature uniformity and its performance, is used for annealing, heat treatment, stress relief, adhesive Ideal for firing, baking ceramics and a range of other high temperature treatments.
