Moisture-proof cabinets are widely used in the production of MSD industry. They can be used for medium and long-term storage of devices, short-term storage on the workshop production line, and light boards, components and partially assembled PCBs can all benefit from ultra-low humidity storage.
As we all know, when MSD is damp, it will produce many hazards such as oxidation, decreased solderability, decreased subsequent processing technology, and reliability. These hazards are mainly reflected in two ways: pressure difference damage, and oxidation of alloy lines and pins .
For moisture that may cause pressure difference damage, by removing the moisture of the MSD, safety can be regained and the MSD floor life can be reset; the usual method is to use low temperature baking to remove the moisture of the MSD to obtain the floor life reset .
In a 5%RH low-humidity storage environment, the moisture precipitation rate of MSD is very slow after being damp, and the MSD reprocessing time will be very long. It is not suitable for online production as a part of the production process. At the same time, the low-humidity storage method is only correct MSD exposed to humid environment for a short time has the effect of dehumidification and regeneration, which is more suitable for long-term storage of MSD.
The low-temperature baking dehumidification method has higher dehumidification and regeneration efficiency. For some high-temperature sensitive MSDs, high-temperature baking will cause oxidation, lead to blackening of the pins, and reduced solderability. Low-temperature baking is a mild type of baking, which will not cause any loss to various SMDs, can prevent the appearance of various potential defective products, and can prevent the stored products from absorbing moisture within one hour after they are out of the box.
Yihexing low-temperature baking drying cabinet combines ultra-low dehumidification technology and low-temperature baking to fully meet the environmental requirements of 40℃+5%RH, and solve the problem of BGA, IC, LED in the manufacturing process of SMT/package testing/PCB/LED industry , CCD, QFP, SOP and other problems caused by adhesion of moisture, such as empty welding, expansion, bursting, etc., greatly improve the package yield.
