The baking of electronic components is actually mainly the baking of IC, BGA-type integrated circuit components, and IC, BGA and other devices are characterized by high integration and complex internal structure. The characteristics of this kind of integrated circuit determine that there will be a lot of gaps inside the device. When these devices are stored under normal temperature and humidity conditions, their gaps will absorb moisture in the air, causing the devices to become damp. When the IC, BGA and other components are exposed to high temperature processes, such as reflow soldering, the moisture in the internal gaps of the device will vaporize, causing the volume of water to increase sharply, and causing the device to expand. Since IC, BGA and other devices are made of rigid materials, they cannot be restored to their original state after expansion. It will cause the internal stress of the device to be out of adjustment, and then cause cracks, delamination, peeling, microcracks and other phenomena, which seriously affect the quality of the device.
The role of component baking is to remove the moisture inside the device before going through high temperature processes such as reflow soldering. In turn, the numerous defects mentioned above are avoided after the device goes online.
Shenzhen Yihexing has a wealth of experience in the electronics industry. The industrial oven equipment produced can perform wafer-level burn-in, magnetic annealing, drying, and thermal decomposition functions, as well as assembly/wafer-level encapsulation functions (such as die bonding). Curing, stability and burn-in test, and thermal shock), can also meet the requirements of clean process, low oxidation, and efficient curing of adhesives and polymers in large-scale semiconductor packaging and assembly production.
The electronic oven produced by Yihexing has the following characteristics:
1. Using intelligent temperature controller, PID automatic calculation, LED display, and SSR solid state relay output, can accurately control the accuracy of temperature;
2. The shell is formed by high-quality cold plate, and the surface is treated by spraying process. Filled with aluminum silicate fiber between the shell and the working room, the sealing and heat insulation effect is obvious.
3. Adopting the convection internal circulation air transport method, the heat energy is preserved, the temperature is uniform, the power and time are saved, the efficiency is high, the operation is convenient, the automatic constant temperature, and the timing baking
4. Intelligent PID automatic constant temperature control, can be set to start timing, constant temperature timing, automatic alarm and disconnect heating element when time is up, automatic alarm and disconnect heating element over temperature, power supply phase loss protection, etc.
5. Nitrogen can be filled to achieve a non-oxidizing baking environment.
Shenzhen Yihexing specializes in the production of pcb board drying equipment, which are mainly used in the electronics industry, pcb industry, led industry and electronic circuit board industry, and are well received by consumers.
