The semiconductor oven is used for pretreatment and baking of silicon wafers, gallium arsenide, lithium niobate, glass and other materials in semiconductor manufacturing; it is also suitable for electronic liquid crystal display, LCD, CMOS, IS, medicine, laboratory and other production and scientific research departments; also It can be used for other high temperature tests such as drying, heat treatment and aging of non-volatile and non-flammable and explosive materials. The semiconductor oven is used in a large amount before and after the packaging process, and it has become one of the important equipment in the process of intelligence and automation.
Features of semiconductor oven products:
1. The oven has the advantages of fast heating, low temperature overshoot, and energy saving;
2. All-round argon welding, high temperature resistant silica gel breaking tight, SUS304# stainless steel electric heater, preventing dust generated by the machine itself;
3. Forced air circulation mode. Double air duct circulation structure, uniform temperature field distribution, intelligent PID temperature control system, get precise temperature control accuracy.
4. PIH+SSR solid-state and AC contactor control output, while equipped with leakage protection, power failure protection, motor overload protection, and over-temperature protection.