In the manufacturing process of semiconductor wafers, the wafers usually need to be placed in an oven for baking operations. One is to dry the ink after the wafer is inked, and the other is to test the high temperature performance, that is, to test the wafer products in the Whether the function is normal under certain high temperature conditions.
Semiconductor wafer ovens, which perform front-end semiconductor functions such as wafer-level burn-in and magnetic annealing, as well as assembly\/wafer-level encapsulation functions (such as die bonding, stability and burn-in testing, and thermal shock) to meet Its annealing, drying and thermal decomposition requirements also meet the requirements of clean process, low oxidation, efficient curing of adhesives and polymers in large-scale semiconductor packaging and assembly production. Semiconductor ovens have the following characteristics:
1. The sealing strip is made of silicone rubber strip, which can withstand temperature without deformation. The door and the inner tank are double-sealed to strengthen the sealing effect and greatly reduce the heat transfer of the inner cavity.
2. The heat of the electric heater placed on the back of the box is discharged forward through the side air duct, and then sucked in by the high-performance special fan on the back after passing through the dry material, forming a reasonable air duct, which can make the hot air fully convect, so that the inside of the box can be fully convected. The temperature is as uniform as possible.
3. Equipped with automatic nitrogen filling device, and automatic opening and closing damper for nitrogen filling and baking;
4. Newly developed touch screen operating system, with high-precision PID master controller, temperature control accuracy is plus 0.1 degrees Celsius, automatic constant temperature. It can save recipes, view temperature curves, export temperature rise data, etc.
5. According to the different needs of customers, we can design and manufacture various box equipment related to temperature and other parameters.
