semiconductorDust-free ovenIt is a special clean and dust-free drying equipment that provides a high-temperature purification environment. The temperature in the working room is automatically controlled by a temperature controller, and there are automatic constant temperature, automatic timing, timing alarm after the temperature reaches, power off, over-temperature power off, leakage protection, Motor overload protection and other functions are reliable in control and safe to use. However, the following matters should also be paid attention to in the use of semiconductor dust-free ovens:
1. Nitrogen port: Before operation, nitrogen should be connected to the nitrogen port of the machine, and special attention must be paid to adjust the N2 pressure to a suitable flow value before connecting.
2. After placing the baked goods in the box, the door must be closed. After the door buckle is firmly fastened, the door safety switch is effective, and the machine can be started smoothly.
3. The cooling air outlet at the rear of the dust-free clean oven should be connected to the exhaust system when there is a high temperature during cooling, and the connecting pipe must be insulated to prevent the operator from being scalded or affecting the working environment.
4. Before starting work, confirm whether the electricity is normal; place the test items in the box correctly; turn on the power switch and adjust the temperature control instrument, the appropriate temperature and heating time, and the operator should concentrate on the operation and wear protective equipment; Do not leave the processing area.
Produced by Shenzhen JardineSemiconductor dust-free ovenUsing a newly developed touch screen operating system, with a high-precision PID master controller, the temperature control accuracy is ± 0.1 degrees Celsius, automatic constant temperature, and can meet the needs of Industry 4.0 production. Suitable for silicon wafers, gallium arsenide, lithium niobate, glass in semiconductor manufacturing Such as pretreatment baking before gluing, hard film baking after gluing and high temperature baking after development.
