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Why use a dust-free nitrogen-filled oven for semiconductor packaging and testing?

2021-12-08   

Semiconductor packaging and testing is a step to verify the function and performance of semiconductor products such as chips and circuits, in order to screen out semiconductor products with structural defects or functions and performance that do not meet the requirements to ensure the normal application of the delivered products.

The main functions of the packaging and testing industry in semiconductor problems are protection, support, connection, heat dissipation and reliability. The production workshops of semiconductor chips have strict production conditions, such as constant temperature and humidity, dust-free cleaning, etc. Only in a suitable environment can it function normally, and the normal environment around us cannot do this in most cases, so it is necessary to encapsulate and test to protect the chip and create a good working environment for it, so it is necessary to use precision semiconductors Special dust-free oven for clean workshop.

1. Applicable area of ​​dust-free oven

This oven is suitable for use in clean workshops. It is suitable for heat treatment such as drying in high-precision semiconductors, curing of glue, and drying of precision optical components after cleaning.

2. Equipment features:

1) SUS304 1.5mm stainless steel plate, full welding process;

2) The air duct in the box is equipped with a clean air inlet and a high-efficiency filter. The ventilation and non-ventilation modes can be used to ensure a slight positive pressure in the box to ensure that pollutants cannot enter the inner box;

3) The high-efficiency filter HEPA filter mesh constructs a clean room, which can filter and circulate the gas in the box in one direction. According to the requirements of use, it can meet the cleanliness level of ISO Class 5 (national standard 100), ISO Class 6 (national standard 1000) , ISO Class 7 (national standard 10000) and other levels of demand;

4) Equipped with an automatic nitrogen filling device, which can be filled with nitrogen to bake with the automatic opening and closing damper;

5) Newly developed touch screen operating system, with high-precision PID master controller, temperature control accuracy of ±0.1 degrees Celsius, automatic constant temperature. It can save recipes, view temperature curves, export temperature rise data, etc.;

6) According to the requirements of use, customization can be accepted.