Semiconductor IC wafer professional oven

FeaturesPRODUCT FEATURES

The semiconductor wafer oven developed by Yee Hing can perform front-end semiconductor functions such as wafer-level burn-in and magnetic annealing, as well as assembly/wafer-level encapsulation functions (such as die bond curing, stability and burn-in tests, and thermal shock) ) To meet its annealing, drying and thermal decomposition requirements, as well as to meet the requirements of clean technology, low oxidation, and efficient curing of adhesives and polymers in large-scale semiconductor packaging and assembly production.

1. Using the effect of forced ventilation, there is an air duct in the oven, the temperature uniformity is 1.5%, and the material is dried evenly.

2. Imported digital intelligent temperature controller, constant temperature control mode, PID automatic calculation, temperature control accuracy ±0.2℃, with sensor disconnection alarm function, over-temperature suppression, over-adjustment function, accurate temperature control, low overshoot , With over-temperature alarm protection function to ensure the safety of product operation.

3. Double flow meter nitrogen saving system, double delay nitrogen filling control, saving nitrogen consumption in anaerobic and low oxygen environment.

4. The junction of the box door and the box body is tightly sealed with high temperature resistant silicon rubber strip, which has good heat preservation performance, anti-aging, environmental protection and no pollution. The door handle of the box adopts the pull-type zinc alloy mechanical handle, which has high mechanical strength, wear resistance and flexible door opening and closing.

5. Adopt LED digital time timer, timing 0~9999H/M/S. Set temperature → set heat preservation time → end of time END prompt-automatically show cut off heating-alarm completion indication.

Product parameterPRODUCT PARAMETERS

The basic configuration of the semiconductor industry oven:

1. Temperature range: RT～180℃;

2. Inner box size: can be customized

3. Number of cabinets: 2, arranged up and down, can be customized;

4. Liner material: SUS321 mirror stainless steel, seamless welding to protect the processed parts from any pollution;

5. Heating time (no load): 1.5h;

6. Heater: special dust-free heater;

7. Over-temperature protector, motor overload protector, buzzer, fault indicator, no fuse switch.

Core configuration

CORE CONFIGURATION