All plastic-encapsulated components or components made of organic materials are easily damaged by moisture. During the reflow soldering process, the rapidly expanding moisture and improper combination of materials can cause cracking or delamination of the key bonding surfaces in the package. Unfortunately, these flaws are difficult to find during PCB assembly and testing. These defects will have a negative impact on the components during production, leading to premature damage to electronic products, even in high-temperature lead-free reflow soldering, the chip may also be damaged. Package cracking caused by internal pressure caused by moisture is called popcorn phenomenon. In extreme cases, PCB assemblies can burst. However, even if the package does not crack, delamination between interfaces often occurs.
Small cracks may also extend to the outer surface of the package, and cracks on the outside of the device may appear on the sides, top and bottom. Due to the small thickness of the packaging material below the pad, cracks are prone to occur on the side of the package, and these cracks are also difficult to identify.
Now for the majority of electronics assemblers, controlling humidity is a big problem compared to a few years ago. A simple reason is that the package design is getting smaller and smaller, and it is easier for moisture to enter the critical areas in the device. These key areas are exactly where the wafer, wire bonding and wire bonding are located. The smaller the thickness of the component, the fewer plastic packages that allow moisture to enter.
solution
Industrial low-humidity and moisture-proof cabinets use physical molecular sieve dehumidification, which can be reused repeatedly, with good dehumidification effects, low power consumption, no noise, no thermal effects, and no magnetic hazards. All humidity sensitive components can not only be stored safely, but also can be quickly dehumidified, intelligently fixed point to maintain dryness, suitable for storage and drying of humidity sensitive components.
