Electronic manufacturing includes semiconductor manufacturing and the manufacturing of electronic packaging and assembly wafers. It is called semiconductor manufacturing. Electronic packaging and assembly refers to the production (package) of bare chips, ceramics, metals, organics and other materials into chips and components from the completion of circuit design. , Boards, circuit boards, the whole process of assembling electronic products.
With the rapid development of the semiconductor industry, the electronics manufacturing industry has gradually evolved into three relatively independent product packaging industries of design, manufacturing and packaging, which are mainly driven by the design and manufacturing industries. Compared with the former two, the scope of electronic packaging is wide, and more basic industries are driven. Electronic packaging has become the bottleneck of the entire electronics manufacturing industry. In a sense, the competition in the electronic information industry is mainly reflected in electronic packaging. However, electronic products also face many challenges, one of which is the storage problem.
When electronic components are exposed to elevated temperature environments, the moisture trapped inside the plastic surface mount components can produce enough vapor pressure to damage or damage the components. Common failure modes include internal separation (delamination) of the plastic from the chip or lead frame, chip damage, and internal cracks that do not extend to the surface of the component. The crack will extend to the surface of the component, and the more serious case is the component swelling and bursting.
If you canNitrogen cabinetInternal storage can ensure the stability and consistency of the surface quality of electronic components to a large extent.
The bare chip should be vacuum sealed in a moisture-proof bag, and the moisture-proof bag should be placed in a dry inert gas environment with a temperature of 18-24°C and a relative humidity of less than 30%. If the package is not vacuum sealed, it needs to be placed in a nitrogen cabinet blown with nitrogen at a rate of 2-6SCFH (standard cubic feet per hour).
Ready-to-install life refers to the specified time allowed for components to leave the storage environment before use, and to be exposed to an environment where the temperature does not exceed 30°C and the relative humidity does not exceed 60%. In order to ensure the validity of the components, the cumulative waiting time of the components in testing, sub-assembly, circulation, etc. from the date of leaving the factory should be less than the component waiting life.
In general, for the unprocessed semi-finished products of electronic components, the shorter the exposure time to the air, the better; the ones that cannot be processed immediately should be stored in a nitrogen cabinet (first in, first out, last in and out).