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Precautions when baking in a semiconductor oven

2022-04-28   

The drying process of different MSDs is also different according to the humidity sensitivity level, size and ambient humidity of the device. After drying the device as required, the ShelfLife and FloorLife of MSD can be calculated from scratch.

Generally, devices installed in high-temperature trays (such as high-temperature Tray trays) can be baked at a temperature of 125 degrees Celsius, unless the manufacturer specifies the temperature. Tray trays are generally marked with specific baking temperatures. The baking temperature of the devices in the tray (such as low temperature Tray tray, tube, and tape) cannot be higher than 40 degrees Celsius, otherwise the tray will be damaged by high temperature.

existSemiconductor ovenBefore baking at high temperature, take off the paper\/plastic bag\/box. Pay attention to ESD (static sensitive) protection when baking, especially after baking, the environment is very dry and it is easy to generate static electricity.

Be sure to control the temperature and time during baking. If the temperature is too high or the time is too long, it is easy to oxidize the device, or generate intermetallic compounds at the internal connections of the device, thereby affecting the solderability of the device. During baking, pay attention to Do not cause the material tray to release unknown gas, otherwise it will affect the solderability of the device. During the baking period, a baking record must be made to control the baking time.

Semiconductor ovenHas the following characteristics:

1, Data coupling with PC can be provided, which allows long-term data storage as well as statistical process control SPC, recipe management and process visualization.

2. Forced air circulation mode, double air duct circulation structure, uniform temperature field distribution, intelligent PID temperature control system, so as to obtain high-precision temperature control.

3. Intelligent production requirements can be achieved. SECS\/GEM is a semiconductor device interface protocol for device-to-host data communication. In an automated factory, the interface can start and stop device processing, collect measurement data, change variables and select recipes for products .

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