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Application and characteristics of semiconductor oven

2021-06-25   

In the semiconductor production process, photolithography is an important process link in the pattern transfer of integrated circuits, and the quality of the coating directly affects the quality of the photolithography. The coating process is more necessary, especially when the carved lines are relatively thin. A slight omission in a link may lead to failure of lithography. In the coating process, most photoresists are hydrophobic, while the hydroxyl groups and residual water molecules on the surface of the wafer are hydrophilic. If the glue is applied directly on the surface of the wafer, the adhesion between the photoresist and the wafer will be relatively high. Poor, even causing local gaps or bubbles.

In the entire IC manufacturing process, the photolithography process is a process that is repeated many times. Lithography is often considered a critical step in IC manufacturing. Photolithography is the process of transferring the integrated circuit pattern from the mask to the wafer. This process mainly refers to the application of glue, exposure and development. Therefore, baking is an important process throughout the entire photolithography process, and the semiconductor oven is derived from this.

The semiconductor oven developed by Jardine Matheson can perform front-end semiconductor functions such as wafer-level burn-in and magnetic annealing, as well as assembly/wafer-level encapsulation functions (such as die bond curing, stability and burn-in tests, and thermal shock). In order to meet its annealing, drying and thermal decomposition requirements, it also meets the requirements of clean technology, low oxidation, and efficient curing of adhesives and polymers in large-scale semiconductor packaging and assembly production.

The semiconductor oven has the following characteristics:

  1. SUS304 1.5mm stainless steel plate, full welding process;

  2. The air duct in the box is equipped with a clean air inlet and a high-efficiency filter. Ventilation and non-ventilation modes can be used to ensure a slight positive pressure in the box to ensure that pollutants cannot enter the inner box;

  3. The high efficiency filter HEPA filter net constructs a clean room, which can carry out one-way filtering and circulating filtering of the gas in the box. According to the requirements of use, it can meet the requirements of various levels of cleanliness such as ISO Class 5 (national standard 100), ISO Class 6 (national standard 1000), ISO Class 7 (national standard 10000);

  4. Equipped with automatic nitrogen filling device, and automatic opening and closing air door for nitrogen filling and baking;

  5. Newly developed touch screen operating system, with high-precision PID master controller, temperature control accuracy of ±0.1℃, automatic constant temperature. You can save recipes, view temperature curves, export temperature rise data, etc.;