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Semiconductor clean oven improves the quality of electronic burn-in test

2020-12-03   

In the manufacturing process of semiconductor components, various inspections of ICs are a step to confirm the quality of products. The burn-in operation is to simulate a high temperature, high voltage, and high current environment through a semiconductor oven. This allows the product to be tested to accelerate the aging process in order to eliminate components with a shorter life cycle earlier. In this burn-in test, the control of the length of time and temperature is an important key to the reliability of the product test, because when the IC is tested under the condition of insufficient time or insufficient temperature, it may cause the original defect Good products flowed into the hands of customers through screening, causing the goodwill of the testing manufacturers to be damaged due to the excessively high defect rate.

Semiconductor packaging oven is a kind of high-function and high-reliability oven. Due to the large amount of use, the increasingly complex structure, and the gradual increase in performance requirements, it has a large amount of use before and after the packaging process. It has become an intelligent and automated process. One of the important equipment.

Shenzhen Yihexing Semiconductor Cleanroom Oven has the following characteristics:

1. The inner material is SUS mirror stainless steel with small thermal deformation, and the outer material is SPCC steel plate through powder spraying, which is wear-resistant and does not drop dust and slag;

2. Thermal insulation material: high-density fiber cotton, good thermal insulation, maximum temperature insulation.

3. Layered structure design: the height of the inner box is adjustable and can be taken out freely;

4. The temperature control is a PID microcomputer automatic calculation intelligent temperature control meter, and PV/SV are displayed at the same time.

5. High efficiency filter: HEPA filter structure clean room and clean level below 100;

6. Internal circulation air design: forced air circulation to ensure uniform temperature;

7. Optional PLC+ HMI man-machine touch screen control system with data output interface. (Optional)

8. It can be equipped with nitrogen filling system (nitrogen gas inlet, automatic preheating control).