The storage and drying of MSD has always been valued by manufacturers of various electronic products. When the MSD storage exceeds the storage period, it is necessary to perform baking and the like. Some SMD devices and motherboards cannot withstand long-term high-temperature baking, such as some FR-4 materials, which cannot withstand 24 hours of 125 °C baking; some batteries and electrolytic capacitors are also sensitive to temperature. Taking these factors into consideration, it is important to choose the right baking method.
1. According to the humidity sensitivity level, size and ambient humidity of the device, the drying process of different MSDs is also different. After drying the device as required, MSD's ShelfLife and FloorLife can be calculated from scratch.
2. Remove the paper/plastic bag/box before baking at 125 °C.
3. Pay attention to ESD (static sensitive) protection during baking. Especially after baking, the environment is particularly dry and it is easy to generate static electricity.
4. The baking temperature of the device installed in the low temperature tray should not be higher than 40 °C, otherwise the tray will be damaged by high temperature.
5. During baking, attention should not cause the tray to release unidentified gas, otherwise it will affect the solderability of the device.
6. Always control the temperature and time when baking. If the temperature is too high, or the time is too long, it is easy to oxidize the device, or an intermetallic compound is generated at the junction inside the device, thereby affecting the solderability of the device.
7. Make a baking record during baking to control the baking time.
Taking into account the special nature of MSD baking, it is recommended to follow the IPC/J-STD-033 standard baking requirements as much as possible to avoid the deterioration of product quality and reliability caused by moisture in the material and high temperature reflow.