Low temperature baking drying cabinet

J-STD-033 has stricter regulations on the exposure of humidity sensitive components (MSD) to the environment. When the exposure exceeds the allowable length of time, moisture will adhere and penetrate into the electronic parts. On the other hand, due to the implementation of the ROHS-free lead-free process, the soldering temperature will be raised, which will easily cause the expansion and bursting of moisture in the electronic parts due to the instantaneous high temperature.

Yihexing low-temperature baking series moisture-proof cabinet combines ultra-low dehumidification technology and low-temperature baking to fully meet the environmental requirements of 40°C+5% RH. This model is especially recommended for PCB packaging factories to perform low-humidity storage on unassembled SMD parts and low-humidity low-temperature baking before packaging, which greatly improves the package yield.

▲ Product Features:

The high-performance intelligent dehumidification temperature control module and the low-temperature micro-control heating technology are combined with the special dehumidification module for secondary dehumidification and moisture removal in the case of rapidly drying the surface moisture of the product to ensure the dry dehumidification and moisture-proof effect.

High-precision display controller, user-friendly operation, fast dehumidification, no consumables.

Built-in heater, the design temperature is controlled within the range of normal temperature to 40°, and the temperature can be set and controlled to meet the different needs of users.

Advanced ultra-low humidity patented technology, good thermal insulation and reduced energy consumption.

Problems caused by traditional high-temperature baking 1 Some MSD tapes and trays are not suitable for high-temperature baking. If the materials are first removed and then baked, the efficiency is very low.
2 Some SMD devices and motherboards cannot be baked at high temperatures for long periods of time.
3 For other SMD devices, the higher the temperature, the more severe the MSD ages. Even if it can withstand high temperature baking for a long time, it will still cause potential thermal damage and easy oxidation, or produce intermetallic compounds at the internal connections of the device, thus affecting the solderability of the device.
4 High temperature baking can only be done once, and must be processed immediately after baking to prevent the device from repeatedly absorbing moisture.

Low-humidity temperature-controlled moisture-proof cabinet has three major advantages for storage products. 1 No pre-baking: It can prevent the appearance of various potential defective products.
2 Gentle baking: no damage to various SMDs during dehumidification 3 Moisturizing effect: It can prevent moisture absorption in one hour after the storage box is out of the box.

▲Scope of application:

All precision parts, various optoelectronics, optical instrumentation and optoelectronic devices, microcomputer chips, etc.